creat by art - dual rectifier construction, positive center-tap - glass passivated chip junctions - superfast recovery time, high voltage - low forward voltage, high current capability - low thermal resistance - low power loss, high efficiency - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 base p/n with suffix "g" on packing code - halogen-free terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test v rrm 50 100 150 200 300 400 600 v v rms 35 70 105 140 210 280 420 v v dc 50 100 150 200 300 400 600 v i f(av) a trr ns cj pf r jc o c/w t j o c t stg o c document number: ds_d1401017 version: g14 - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec mechanical data case: to-247ad (to-3p) polarity: as marked sf3001pt thru sf3008pt taiwan semiconductor glass passivated su p er fast rectifiers features sf 3001 pt sf 3002 pt sf 3003 pt sf 3004 pt sf 3005 pt to-247ad (to-3p) sf 3006 pt sf 3008 pt unit maximum repetitive peak reverse voltage maximum rms voltage mounting torque: 10 in-lbs maximum weight: 5.6g (approximately) maximum ratings and electrical characteristics (t a =25 unless otherwise noted) parameter maximum reverse recovery time (note 2) symbol maximum dc blocking voltage maximum average forward rectified current 30 peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 300 maximum reverse current @ rated vr t j =25 t j =125 i r a maximum instantaneous forward voltage (note 1) i f = 15 a v f 1.7 v typical thermal resistance 1.0 operating junction temperature range 175 - 55 to +150 storage temperature range - 55 to +150 note 2: reverse recovery test conditions: i f =0.5a, i r =1.0a, recover to 0.25a. note 3: measured at 1 mhz and applied reverse voltage of 4.0v d.c. note 1: pulse test with pw=300 s, 1% duty cycle 0.95 1.3 10 500 a 35 typical junction capacitance (note 3)
part no. part no. sf3006pt sf3006pt (ta=25 unless otherwise noted) document number: ds_d1401017 version: g14 sf30xxpt (note 1) c0 suffix "g" to-3p sf3001pt thru sf3008pt taiwan semiconductor ordering information packing code green compound code package example preferred p/n packing code green compound code green compound description 30 / tube packing ratings and characteristics curves sf3006pt c0 c0 sf3006pt c0g c0 g note 1: "xx" defines voltage from 50v (sf3001pt) to 600v (sf3008pt) 0 6 12 18 24 30 36 050100150 average forward a current (a) case temperature ( o c) fig.1- maximum forward current derating curve resistive or inductive load with heatsink 0 50 100 150 200 250 300 1 10 100 peak forward surge current (a) number of cycles at 60 hz fig. 3- maximum non-repetitive forward surge current 8.3ms single half sine wave jedec method 0.1 1 10 100 1000 0 20 40 60 80 100 120 140 instantaneous reverse current ( a) percent of rated peak reverse voltage (%) fig. 2- typical reverse characteristics tj=25 tj=100 tj=75 0.1 1 10 100 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 instantaneous forward current. (a) forward voltage. (v) fig. 4- typical instaneous forward characteristics 125 o c 25 o c pulse width=300 s 1% duty cycle sf3005pt-08pt sf3001pt-04pt
min max min max a 15.90 16.40 0.626 0.646 b 7.90 8.20 0.311 0.323 c 5.70 6.20 0.224 0.244 d 20.80 21.30 0.819 0.839 e 3.50 4.10 0.138 0.161 f 19.70 20.20 0.776 0.795 g - 4.30 - 0.169 h 2.90 3.40 0.114 0.134 i 1.93 2.18 0.076 0.086 j 2.97 3.22 0.117 0.127 k 1.12 1.22 0.044 0.048 l 5.20 5.70 0.205 0.224 m 4.90 5.16 0.193 0.203 n 2.70 3.00 0.106 0.118 o 0.51 0.76 0.020 0.030 p/n = marking code g = green compound yww = date code f = factory code document number: ds_d1401017 version: g14 marking diagram sf3001pt thru sf3008pt taiwan semiconductor package outline dimensions dim. unit (mm) unit (inch) 10 100 1000 0.1 1 10 100 capacitance (pf) reverse voltage. (v) fig. 5- typical junction capacitance f=1mhz vsig=50mvp-p
creat by art assumes no responsibility or liability for any errors inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1401017 version: g14 sf3001pt thru sf3008pt taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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